Advanced Packaging: 2.5D and 3D Integration – Where Chips Dream in Dimensions
In the ever-evolving symphony of VLSI technology, where innovation knows no bounds, a chapter unfolds that’s nothing short of magical: Advanced Packaging. This is the story of how chips, once confined to the flatlands, now dream in dimensions, stacking their talents in skyscrapers of silicon through 2.5D and 3D Integration, rewriting the rules of connectivity. […]